MediaTek Dimensity 900- Specs!

MediaTek has announced the new Dimensity 900 chipset, which is the newest in its lineup of chipsets made using the 6nm process. The new chipset comes as a step below the Dimensity 1000 Plus chipset which launched last year.

The Dimensity 900 chipset, built on the 6nm high-performance manufacturing node, also supports Wi-Fi 6 connectivity, FHD+ 120Hz displays and a 108MP main camera for an all-around incredible experience.

The MediaTek Dimensity 900 comes with an octa-core central processing unit (CPU) consisting of two Arm Cortex-A78 processors with a clock speed of up to 2.4GHz and six Arm Cortex-A55 cores operating at up to 2GHz. The Dimensity 900 chipset is integrated with a 5G New Radio (NR) sub-6GHz modem with carrier aggregation and support for bandwidth up to 120MHz.

The chipset integrates an HDR-native image signal processor (ISP) and incorporates a unique hardware-accelerated 4K HDR video recording engine. This supports up to four concurrent cameras and up to 108MP sensors.

The MediaTek Dimensity 900 is designed to capture every detail in all environments, with its exceptional 4K HDR video recording engine and flagship-grade noise reduction. 5G integrated into the chip gives faster, longer-range connections and exceptional power efficiency with innate enhancements and a leading 6nm design push the boundaries of smartphone battery life.

The chipset packs upgraded video capabilities from a standard dynamic range (SDR) to HDR with real-time enhancements of HDR10+ video playback to improve the colour and contrast of content.

Smartphones powered by the Dimensity 900 will capture every detail with support for up to 108MP cameras with 32MP at 30fps and multi-camera options such as 20MP + 20MP. The chipset integrates an AI processing unit with ultra-efficient INT8, INT16 and accurate FP16 data type capabilities to deliver premium and super precise AI-camera results. It will also support up to LPDDR5 RAM, UFS 3.1 storage, Bluetooth 5.2, 4x4 MIMO antennae, and will be powered by Arm’s Mali-G68 GPU unit.

Brands can opt to use either LPDDR5 or LPDDR4X memory, UFS 3.1 or UFS 2.2 storage, enabling them to differentiate smartphone designs based on market performance expectations and price points. The Dimensity 900 incorporates a unique hardware-accelerated 4K HDR video recording engine. Combined with flagship-grade noise reduction techniques (3DNR + MFNR), the chip enables exceptional visuals in 4K HDR video capture. Supporting the latest 108MP main cameras among multi-camera arrays, users can photograph 35% more detail versus previous generation Dimensity chips.

Meeting the ‘streamer generation’ demands for 4K HDR video and single camera AI-bokeh, the Dimensity 900 provides real, AI processing unit –with ultra-efficient INT8, INT16 and accurate FP16 capabilities, for exceptional AI-camera experiences.

The Dimensity 900 is the only chip in its class to flexibly support these leading memory and storage standards without requiring a platform redesign.

The new MediaTek Dimensity 900 is expected to power the upcoming Oppo Reno 6 and other mid-ranged devices that are expected to be launched in the global market in Q2 2021.

Dimensity 900 provides dual 5G SIM to high-end 5G smartphone users. With 5G-SA (standalone) that’s always ready, users also have access to premium VoNR call services from both connections whenever they need it. The 5G modem is fully integrated into the ultra-efficient 6nm chip. Combined with MediaTek 5G UltraSave, the Dimensity 900 is enhanced with even more power-saving technologies:

  • MediaTek 5G UltraSave Network Environment Detection
  • MediaTek 5G UltraSave OTA Content Awareness
  • Dynamic BWP
  • C-DRX (Connected Mode DRX)




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