MediaTek Dimensity 810 and MediaTek Dimensity 920

Dimensity 810

The processor MediaTek Dimensity 810 is developed on the 6 nm technology node and architecture Cortex-A76 / Cortex-A55. Its base clock speed is 2.00 GHz, and maximum clock speed in turbo boost — 2.00 GHz. MediaTek Dimensity 810 contains 8 processing cores. To make a right choice for computer upgrading, please get familiar with the detailed technical specifications and benchmark results. Check socket compatibility before choosing.

This high-end setup will contribute to a rich user experience by offering lag-free interfaces, snappier app responses, and smooth multi-tasking. The 6nm building process of this SoC allows it to deliver this rich performance while being incredibly power efficient. Ultimately, the Dimensity 810 empowers phone makers like realme to make some of the slimmest and lightest 5G smartphones that bring powerful performance and excellent battery life. This chipset’s adoption of the LPDDR4x memory, premium UFS storage, and the MediaTek HyperEngine 2.0 gaming technology are a few more aspects that contribute to its speedy nature.

The MediaTek Dimensity 810 doesn’t just integrate a 5G modem, but it also enhances it with technologies that make sure that phones will face no issues while connecting to the super-fast wireless standard. Firstly, there’s 2CC Carrier Aggregation onboard, allowing the 5G modem to cover a wide spectrum. It means devices will be able to offer higher average speeds as well as uninterrupted handovers between two 5G connection areas. Plus, this chipset’s Mixed Duplex (FDD + TDD) 5G Carrier Aggregation brings with it greater speed, coverage, and connection reliability.

Slick 120Hz displays

120Hz displays are no longer the domain of premium flagship smartphones. Thanks to chipsets like the MediaTek Dimensity 810, manufacturers can bring the feature to more competitively priced phones and deliver a splendid user experience with smooth scrolling and augmented gaming visuals. Games that support high refresh rate displays can completely eliminate motion blur, which makes a huge difference to their visuals. Thanks to this chipset’s support for 120Hz displays with FHD+ resolution, such panels are all set to become more common in mainstream phones.

Mediatek Dimensity 810 top level processor is installed in mobile gadgets such as tablets and phones, date of announcement 2020. The CPU created by a 6 nm process. The chip has a eight cores divided into two clusters. The first ARM Cortex-A76 is the most high-performance with four cores working at 2.4 GHz. The second ARM Cortex-A55 has four cores working at 2.0 GHz. The SoC has support for 64-bit data. Mali-G57 MC2 GPU works with graphical data.
Devices that have the Mediatek Dimensity 810 can work in LTE and 5th generation networks. Maximum speed of download and upload are 2770 MBit/s and 1250 MBit/s with the 5G Multi-Mode modem.

In the visual department, the SoC supports up to 120Hz refresh rate and FHD+ display. In terms of memory, the chipset supports LPDDR4x RAM and UFS 2.2 internal storage while the Arm Mali-G57 MC2 and MediaTek HyperEngine 2.0 handles gaming and graphics content. The Dimensity 810 supports carrier aggregation, dual 5G, Bluetooth 5.1, Wi-Fi 5, NavIC, and up to 64MP multi-camera array along with AI effects.

Dimensity 920

The second chipset in the Dimensity 900 series features four Arm Cortex-A78 clocked at 2.5GHz and four Arm Cortex-A55 clocked at 2.0GHz. It is built on TSMC’s 6nm fabrication process. MediaTek claims the Dimensity 920 offers up to 9% faster gaming performance over the Dimensity 900. One of the key features of the chipset is on the video recording front. The Dimensity 920 is capable of handling 4K HDR video recording as it combines flagship-grade noise reduction techniques (3DNR + MFNR).

Continuing with the optics, the MediaTek Dimensity 920 chipset is also capable of handling 108MP main cameras along with support for multiple camera arrays. A bunch of AI-centric camera features are also included. In terms of memory, the SoC can handle LPDDR5 and UFS 3.1, or LPDDR4X and UFS 2.2 combination.